
Fraunhofer collaborated with Spinverse to secure Chips pilot line funding of EUR 730 million for Advanced Chip Packaging
Spinverse successfully supported Fraunhofer in securing a substantial grant with a total of EUR 730 million for a new Microelectronics pilot line under the recent EU Chips Act. The funding from Horizon Europe and Digital Europe Programmes is earmarked for a groundbreaking APECS pilot line focused on Advanced Packaging and Heterogeneous Integration of Electronic Components and Systems.